Wafer Saw (WS4000)

Specs:
* Blade Speed : 1000~5000 rpm
* Cutting Depth : 10-500μm ± 1μm
* Cutting Sample Size : 2”~6”
* Cutting Blade Z travel : 80mm
* Positioning Accuracy : 1μm
* PLC Control
* User Interface : Touch Panel
* Water jetting, draining, and splashing protection included
* Image system (optional)
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