Thermal compress bonder (TCB-Series)

Specs:
*Bonding Area : Max. 120mm×120mm
*Bonding Pressure: Max. 15,000N
*Tempe. Control: 250℃(top), 300℃(bottom)
*Substrate size : Min. 50mm×50mm
Max. 120mm×120mm
*Dimension: 900(W)×900(D)×1,900(H)mm
所有文章
×