Hot Embossing Machine (HE200)

Features:
*vacuum_chuck
*Hot plate
*Wafer holder
更多詳情

Applications:
•BioMEMS/Bio-Sensors
•Micro-Fluidic Devices
• Micro-Optics
•m-TAS (Micro Total Analysis Systems)


Specifications:
•Sample Size:upto 4" (others on request)
•Operating temperature:RT~200°C (others on request)
•Embossing Force:< 4 kgw/cm2
•Heating Time:~20 minutes
•Cooling Time:(depends on cooling system)
•Molding Material: PDMS,PMMA ...
•Dimensions (L/W/H): 395 mm x 280 mm x 370 mm
·Weight: 35 kgw
 

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